Innovations in the packaging industry (TST)
SPEAKERS: Brian Dynda, Packaging Engineer/Sales Doug Brown Packaging Products, Inc.
TOPIC: Brian will speak on innovations in the packaging industry. Brain manages the Northwest Ohio territory with a focus on bagging, food packaging, fulfillment and industrial packaging. He has an extensive background in packaging and is a graduate of Michigan State University’s school of packaging. Doug Brown Packaging specialties are in: Protective Packaging, sustainable packaging products, returnable packaging, standard polybags, Autobags, Cortec VCI products, Sealed Air Products, and Ranpak products.
TST is dedicated to serving its member organizations, corporations, educational institutions and individuals to help keep this region vital, viable and growing. Such an umbrella organization facilitates cooperative efforts by gathering engineering, technology, business and community together for monthly Friday luncheons as well as cosponsoring the award-winning Toledo Area Engineers Week.